Electroninks to show EMI shielding and packaging inks at SEMICON India 2026

Electroninks will exhibit at SEMICON India 2026 in New Delhi from Sept. 17-19 with distribution partner Baba Fine Chemicals, highlighting metal complex inks for EMI shielding, iSAP and backside metallization. The company is using the event to court India’s expanding semiconductor manufacturing and packaging market.

Why it matters: - Electroninks is positioning its metal complex inks for semiconductor packaging as India pushes to expand domestic manufacturing and supply-chain capacity. - The company is targeting applications that affect performance, reliability and manufacturing cost in RF modules, advanced packages and AI chips. - The booth presence with Baba Fine Chemicals gives Electroninks direct access to customers, partners and industry stakeholders in India’s electronics ecosystem.

What happened: - Electroninks said it will exhibit at SEMICON India 2026 from Sept. 17-19 at the India International Convention & Expo Centre in New Delhi. - The company will be at booth H4223 in Hall 2 with distribution partner Baba Fine Chemicals. - Electroninks will show its metal complex ink portfolio for EMI shielding, integrated semi-additive process, or iSAP, and backside metallization. - Dhaval Patel, chief financial officer; Brian Liu, APAC sales director; and Takashi Mochizuki, global sales director, will represent Electroninks at the show.

The details: - Electroninks will demonstrate spray-coated MOD, or metal organic decomposition, silver inks for EMI shielding. - The EMI shielding inks are designed to provide immediate metallization and strong sidewall and corner coverage. - Electroninks says the inks are built for shielding performance and reliability in RF modules and advanced packages. - The company says the EMI shielding inks can reduce capital equipment, footprint and energy costs compared with conventional metallization. - Electroninks says the same approach also supports better thermal and 3D metallization for advanced AI chips. - The booth will also feature MOD silver inks for iSAP applications. - The iSAP inks are designed to enable fine-line redistribution layer formation with the conductivity and adhesion needed for advanced packaging. - Electroninks says the additive process can build conductive seed layers digitally without the masking and etching steps used in subtractive processes. - Electroninks will also show a spray-deposited MOD silver ink for backside metallization. - The backside metallization ink is designed to support metal-based thermal interface material integration in RF module and logic device packaging. - Electroninks says the ink forms a dense, highly conductive film with the adhesion and reliability needed for stable metallurgical bonding. - Electroninks says the backside metallization ink offers a scalable, atmospheric-pressure process for wafer and larger panel applications. - Takashi Mochizuki said India is one of the fastest-growing semiconductor manufacturing bases in the world. - Mochizuki said the partnership with Baba Fine Chemicals puts Electroninks close to customers building that capacity. - Mochizuki said manufacturers in India want materials that can scale with them.

Between the lines: - Electroninks is leaning into packaging and materials, not just raw semiconductor manufacturing, as a way to benefit from India’s buildout. - The focus on additive metallization suggests the company is pitching lower-complexity manufacturing as much as materials performance. - Co-hosting with a distribution partner can help Electroninks localize go-to-market efforts in a market where customer access and integration support matter. - SEMICON India’s joint organization by the India Semiconductor Mission, the Ministry of Electronics and Information Technology and SEMI gives the event added policy and industry weight.

What's next: - Electroninks invited attendees to visit booth H4223 in Hall 2 for live demonstrations and discussions on integrating additive metallization into existing manufacturing lines. - The company said more information on its products and solutions is available at Electroninks. - Electroninks is signaling continued investment in India as the country builds out domestic manufacturing, packaging and materials supply chains.

The bottom line: - Electroninks is using SEMICON India 2026 to sell itself as a materials partner for the next wave of semiconductor packaging in India.